 |
|
정밀하게 조절된 제품의 녹는점과 레진 흐름성은 예측 가능한 Laminates Cycle을 제공합니다. 또한 저비용과 전기적으로 안정된 PCB 생산이 가능합니다. |
| Products | DK+ Tolerance |
Loss Factor |
Data Sheet |
Safety Data Sheet |
Processing Information |
Comments |
| fastRise™ 25, 26, 27, 28 (FR-27-0045-35) |
2.72 ± 0.04 | 0.0014 | Download | Download | Download | Lowest loss non-reinforced prepreg |
| fastRise™DS | 2.96 | 0.0018 | Download | Download | Download | Dimensionally stable lowest loss glass- reinforced prepreg |
| fastRise™EZ pure |
2.8 | 0.0032 | Download | Download | Download | Low temperature curing, thermosetting prepreg |
| TacBond 1.5 | 2.35 | 0.0025 | Download | Download | - | Thermoplastic bonding film |
| HB-series | 3.02-3.67 | 0.0027-0.0029 | Download | Download | - | RF/multilayer components |
