페이지 상단으로 이동
  • HomeIcon
  • Home
  • >
  • Product
  • >
  • RF(통신 기판 제품)
Bond Plies/Prepregs

정밀하게 조절된 제품의 녹는점과 레진 흐름성은 예측 가능한 Laminates Cycle을 제공합니다.
또한 저비용과 전기적으로 안정된 PCB 생산이 가능합니다.

Products DK+
Tolerance
Loss
Factor
Data
Sheet
Safety
Data
Sheet
Download
Processing
Information
Comments
fastRise™
25, 26, 27, 28
(FR-27-0045-35)
2.72 ± 0.04 0.0014 Download Download Download Lowest loss non-reinforced prepreg
fastRise™DS 2.96 0.0018 Download Download Download Dimensionally stable lowest loss glass-
reinforced prepreg
fastRise™7 7.45 0.0030 Download Download Download High DK, low loss glass-reinforced prepreg
fastRise™EZ
pure
2.8 0.0032 Download - Download Low temperature curing,
thermosetting prepreg
TacBond 1.5 2.35 0.0025 Download Download - Thermoplastic bonding film
HB-series 3.02-3.67 0.0027-0.0029 Download - - RF/multilayer components


line