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Closely controlled melt point and resin flow provides a predictable laminating cycle. It enables low cost, electrically stable PCB fabrication. |
| Products | DK+ Tolerance |
Loss Factor |
Data Sheet |
Safety Data Sheet |
Processing Information |
Comments |
| fastRise™ 25, 26, 27, 28 (FR-27-0045-35) |
2.72 ± 0.04 | 0.0014 | Download | Download | Download | Lowest loss non-reinforced prepreg |
| fastRise™7 | 7.45 | 0.0030 | Download | Download | Download | High DK, low loss glass-reinforced prepreg |
| fastRise™EZ pure |
2.8 | 0.0032 | Download | Download | Download | Low temperature curing, thermosetting prepreg |
| TacBond 1.5 | 2.35 | 0.0025 | Download | Download | - | Thermoplastic bonding film |
| HB-series | 3.02-3.67 | 0.0027-0.0029 | Download | Download | - | RF/multilayer components |
