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Bond Plies/Prepregs

Closely controlled melt point and resin flow provides a predictable laminating cycle. It enables low cost, electrically stable PCB fabrication.

Products DK+
Tolerance
Loss
Factor
Data
Sheet
Safety
Data
Sheet
Processing
Information
Comments
fastRise™
25, 26, 27, 28
(FR-27-0045-35)
2.72 ± 0.04 0.0014 Download Download Download Lowest loss non-reinforced prepreg
fastRise™DS 2.96 0.0018 Download Download Download
Dimensionally stable lowest loss glass-
reinforced prepreg

fastRise™7 7.45 0.0030 Download Download Download High DK, low loss glass-reinforced prepreg
fastRise™EZ
pure
2.8 0.0032 Download Download Download Low temperature curing,
thermosetting prepreg
TacBond 1.5 2.35 0.0025 Download Download - Thermoplastic bonding film
HB-series 3.02-3.67 0.0027-0.0029 Download - - RF/multilayer components


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