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| Tacsil is a double-sided silicone tape coated with a reusable silicone compound and heat resistive silicone adhesive. It is specifically designed to temporarilyfix FPC or tiny components toa carrier jig during SMT processing. Easy-to-clean Tacsil is cost-effective due to its reuseeven in high temperature environments. |
| Series No | TACSIL F20 Series | TACSIL G20 Series | TACSIL P20 Series | ||||||||||||||||||
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| Note | Porous "P" version uses breathable PTFE coated fabric to minimize air bubbles |
| <Features & Benefits> |
| ㆍ Excellent dimensional stability at high temperature (No distortion, shrinkage/expansion at 260℃ continuous usage condition.) |
| ㆍ Superior adhesion and holding power of silicone adhesive |
| ㆍ No adhesive residue after removal |
| ㆍ Longer life time of silicone resin side |
| ㆍ Easy cleaning using cleaning roller allows extended lifetime |
| ㆍ Good surface flatness allows the whole area of FPC to be fixed |
| ㆍ Adhesion level of silicone compound can be controlled for customer's requirement (Low - Moderate - Standard - High - High2 - High3) |
| ㆍ Excellent cut & die-cut properties |
| ㆍ Easy fixing and easy removal |
| ㆍ Provides flexibility for carrier design |
<Product Line-up>
| Peel adhesion of reusable silicone compound | ||||||
| 10gf/25mm | 20gf/25mm | 30gf/25mm | 40gf/25mm | 130gf/25mm | 300gf/25mm | |
Tacsil F20 |
Tacsil F20 LB |
Tacsil F20 MB |
Tacsil F20 B |
Tacsil F20 HB |
Tacsil F20 H2B |
Tacsil F20 H3B |
Tacsil F20 Porous type |
Tacsil F20 LBP |
Tacsil F20 MBP |
Tacsil F20 BP |
Tacsil F20 HBP |
Tacsil F20 H2BP |
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Tacsil G20 |
Tacsil G20 H |
Tacsil G20 H2 |
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Tacsil P20 |
Tacsil P20 L |
Tacsil P20 M2 |
Tacsil P20 | Tacsil P20 HB |
Tacsil P20 H2B |
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| <Applications> |
| ㆍ SMT Process |
| - Reflow Soldering of FPC, Thin Rigid PCB & Rigid-flex PCB, etc |
| ㆍ Assembly Process (including curing, wire bonding, etc) | |
| - MEMS Microphone | - Accelerometer Sensor, Gyro Sensor |
| - Camera Module, Vibration Motor | - Humidity Sensor, Temperature Sensor, etc. |
| - Wireless LAN Module, GPS Module | |
| - RF Module | |
| ㆍ Flip Chip Mounting Process | |
| - Flip Chip Mounting | |
| ㆍ LED Packaging Process |
| - LED Chip Bonding, Wire Bonding, Molding, etc. |
| ㆍ Display Panel Process |
| - Carrier of LCD Panel, OLED Panel |
| - Temporary Fixing of Touch Panel |
| - Detaching Protection Films from LCD Panel or Polarizing Film |
| - Probe Station |
| - Fixing of Electrostatic Chuck |
| ㆍ Substrate Manufacturing Process |
| - Dicing of LTCC, CSP or Inductor substrates |
| - MLCC Termination |
| - Micro-polishing of Thin Package Substrate |
| <Tacsil use> |
| ㆍ FPC SMT Process |
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| Cut & Attach Tacsil on plates | After attach Tacsil on Plate | Fix FPCB on Tacsil |
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| Moving along the reflow process | Soldercream coat or mounting process | Reflow soldering process |
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| Remove FPCB from Tacsil | Inspect FPCB | Clean as needed and reuse |
