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TACSIL

Tacsil is a double-sided silicone tape coated with a reusable silicone compound and heat resistive silicone adhesive. It is specifically designed to temporarilyfix FPC or tiny components toa carrier jig during SMT processing. Easy-to-clean Tacsil is cost-effective due to its reuseeven in high temperature environments.


Series No TACSIL F20 Series TACSIL G20 Series TACSIL P20 Series
Structure

Reusable Liner
(50㎛ PI)


Reusable Silicone
Resin

PTEE Coated Fabric
Heat Resistive
Silicone Adhesive


Release Liner
(75㎛ PET)

Reusable Liner
(25㎛ PET)


Reusable Silicone
Resin

Silicone Fabric
Heat Resistive
Silicone Adhesive


Release Liner
(75㎛ PET)

Reusable Liner
(50㎛ PI)


Reusable Silicone
Resin

PI Film
Heat Resistive
Silicone Adhesive


Release Liner
(75㎛ PET)
Note
Porous "P" version uses breathable
PTFE coated fabric to minimize air
bubbles

   


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<Features & Benefits>
 
Excellent dimensional stability at high temperature
   (No distortion, shrinkage/expansion at 260℃ continuous usage condition.)
Superior adhesion and holding power of silicone adhesive
No adhesive residue after removal
Longer life time of silicone resin side
Easy cleaning using cleaning roller allows extended lifetime
Good surface flatness allows the whole area of FPC to be fixed
Adhesion level of silicone compound can be controlled for customer's
    requirement (Low - Moderate - Standard - High - High2 - High3)
Excellent cut & die-cut properties
Easy fixing and easy removal
Provides flexibility for carrier design


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<Product Line-up>

  Peel adhesion of reusable silicone compound
10gf/25mm 20gf/25mm 30gf/25mm 40gf/25mm 130gf/25mm 300gf/25mm

Tacsil F20

Tacsil F20
LB
Tacsil F20
MB
Tacsil F20
B
Tacsil F20
HB
Tacsil F20
H2B
Tacsil F20
H3B

Tacsil F20
Porous type

Tacsil F20
LBP
Tacsil F20
MBP
Tacsil F20
BP
Tacsil F20
HBP
Tacsil F20
H2BP
 

Tacsil G20

      Tacsil G20
H
Tacsil G20
H2
 

Tacsil P20

Tacsil P20
L
    Tacsil P20
HB
Tacsil P20
H2B
 


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<Applications>
 
SMT Process
     - Reflow Soldering of FPC, Thin Rigid PCB & Rigid-flex PCB, etc
 
Assembly Process (including curing, wire bonding, etc)
     - MEMS Microphone - Accelerometer Sensor, Gyro Sensor
     - Camera Module, Vibration Motor - Humidity Sensor, Temperature Sensor, etc.
     - Wireless LAN Module, GPS Module  
     - RF Module  
 
Flip Chip Mounting Process
     - Flip Chip Mounting
 
LED Packaging Process
     - LED Chip Bonding, Wire Bonding, Molding, etc.
Display Panel Process
     - Carrier of LCD Panel, OLED Panel
     - Temporary Fixing of Touch Panel
     - Detaching Protection Films from LCD Panel or Polarizing Film
     - Probe Station
     - Fixing of Electrostatic Chuck
 
Substrate Manufacturing Process
     - Dicing of LTCC, CSP or Inductor substrates
     - MLCC Termination
     - Micro-polishing of Thin Package Substrate


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<Tacsil use>
 
FPC SMT Process
 

Cut & Attach Tacsil on plates   next         After attach Tacsil on Plate        next   Fix FPCB on Tacsil
Cut & Attach Tacsil on plates   After attach Tacsil on Plate   Fix FPCB on Tacsil


Moving along the reflow process next Soldercream coat or mounting process next Reflow soldering process
Moving along the reflow process   Soldercream coat or mounting process   Reflow soldering process



   Take off FPCB on Tacsil    next    Inspect FPCB        next    Cleaning as occasion demands&reuse
Remove FPCB from Tacsil   Inspect FPCB   Clean as needed and reuse